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Ardentec Corporation donated a wafer probe card needle alignment machine to Feng Chia University on January 19, 2024, in the hope that FCU faculty and students will continue advancing related technologies and bring new energy to semiconductor education in Taiwan. The donation ceremony was attended by Dean Chi-Chang Wang of the College of Engineering and Science, Dean Tsu-Wang Shen of the College of Information and Electrical Engineering, Vice President Ching-Cheng Rao of Ardentec Corporation, and senior executives from both sides. Together they witnessed the academic and industrial achievements of their collaboration, further strengthening the ties between industry and academia and setting a successful example of a win-win partnership.
Ardentec donates a wafer probe card needle alignment machine to FCU. Dean Chi-Chang Wang (left) presents a certificate of appreciation to Vice President Ching-Cheng Rao on behalf of the university.
FCU faculty and Ardentec will continue to deepen their collaboration and cultivate more outstanding semiconductor talent.
To cultivate industry talent and drive technological development, FCU signed an Industry-Academia Alliance Memorandum of Understanding with Ardentec in May 2021. Since then, the two sides have launched a series of off-campus internship programs and pre-admission talent development projects, while jointly promoting four technology R&D projects with the College of Engineering and Science and the College of Information and Electrical Engineering.
The donated machine represents the first-stage outcome of this collaboration. A master's thesis derived from the project, "Development of a Semi-Automatic Precision System for Cantilever Probe Card Repair in Semiconductor Wafer Testing," received an Honorable Mention at the 20th HIWIN Thesis Award. The machine integrates multiple elements of smart manufacturing and precision machinery, including precision transmission and positioning, real-time vision recognition, dual-loop PID precision control, and ergonomic design. These features allow it to support a wide range of undergraduate and graduate courses in intelligent machinery, giving students hands-on learning opportunities. In teaching, the machine enables students to put theory into practice while gaining a deeper understanding of industry needs and developing practical skills. In research, the platform can be developed into a fully automated needle alignment mechanism with a precision posture-adjustment subsystem that replicates manual alignment, offering significant research value to both academia and industry.
Following the ceremony, the two sides held a joint discussion covering future plans for the machine and the launch of Ardentec-dedicated courses. The donation marks not only the beginning of deeper cooperation between FCU and Ardentec, but also a fine example of industry-academia collaboration in Taiwan. Both parties will continue working together to cultivate outstanding technology talent, drive innovation, and support industrial transformation—opening a new chapter for Taiwan's semiconductor development.
The master's thesis "Development of a Semi-Automatic Precision System for Cantilever Probe Card Repair in Semiconductor Wafer Testing" received an Honorable Mention at the 20th HIWIN Thesis Award.
Development of the semi-automatic needle alignment machine.
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