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The 2026 International Conference on Advanced Plasma for Semiconductors (ICAPS 2026), organized by the Feng Chia University–Fraunhofer Innovation Platform (FIP-SPE@FCU), was held from July 8 to 9 at Xue Si Building on the Feng Chia University campus. Under the theme of “Simulation, Artificial Intelligence, and Plasma Processes in Semiconductor Manufacturing,” the conference attracted approximately 160 scholars, research institute representatives, industry experts, and young researchers from Taiwan, Germany, Korea, Japan, and Hong Kong to explore the latest research achievements and technological developments in advanced semiconductor manufacturing.
As Taiwan’s first Fraunhofer Innovation Platform, FIP-SPE@FCU integrates the research strengths of Feng Chia University and the German Fraunhofer research system in surface engineering, thin-film technology, smart monitoring, process simulation, and production automation. The platform also promotes Taiwan-Germany technology exchange, international industry-academia collaboration, and high-level talent development. The hosting of ICAPS 2026 demonstrated the platform’s ability to connect international academic institutions, applied research organizations, and technology industries.
As semiconductor devices move toward higher integration, three-dimensional structures, advanced packaging, and smart manufacturing, process complexity and equipment control requirements continue to increase. Technologies such as plasma etching, thin-film deposition, surface activation, and plasma diagnostics have become essential to advanced semiconductor manufacturing. Meanwhile, the integration of artificial intelligence, digital twins, virtual metrology, and computational simulation is opening new directions for process prediction, autonomous control, and intelligent equipment. ICAPS 2026 brought together plasma science, process development, computational simulation, diagnostic technologies, and artificial intelligence within a shared exchange framework, highlighting the semiconductor industry’s shift from experience-based trial and error toward data-driven and intelligent decision-making.
The two-day conference featured 14 academic, research, and industry experts, including two plenary talks, four keynote speeches, and eight invited talks. Plenary speakers included Wei-Ying Ma, Chair Professor at City University of Hong Kong, and Dr. Ralf Bandorf from the Fraunhofer Institute for Surface Engineering and Thin Films (Fraunhofer IST) in Germany. Their talks addressed AI-driven scientific research and plasma and thin-film applications, respectively, echoing the conference’s core focus on linking artificial intelligence with semiconductor plasma processes. The program also showcased Feng Chia University’s achievements in plasma technology and its collaboration with two internationally renowned research institutions. Topics covered included virtual plasma processes, machine learning for plasma spectroscopy, semiconductor process simulation, and equipment lifetime prediction.
Wei-Ying Ma, Chair Professor at City University of Hong Kong, was invited to deliver a keynote speech at ICAPS 2026 on AI-driven scientific research, sharing the latest technology trends with participating scholars.
Dr. Ralf Bandorf from the Fraunhofer Institute for Surface Engineering and Thin Films (Fraunhofer IST) in Germany delivered a plenary talk at the conference.
Domestic speakers included Feng Chia University Chair Professor Chu-Liang Ho, Professor Chang-Ann Yuan, Professor Chen-Che Hsu from the Department of Chemical Engineering at National Taiwan University, Chair Professor Chih-Wei Lee from Ming Chi University of Technology, and Professor Kun-Mo Lin from the Department of Mechanical Engineering at National Chung Cheng University.
International invited speakers included Professor Byungjo Kim from the Ulsan National Institute of Science and Technology (UNIST), Professor MunPyo Hong from Korea University, Professor Kazunori Takahashi from Tohoku University, Associate Professor Shih-Nan Hsiao from Nagoya University, Dr. Philipp Schulz from Fraunhofer IST, and Dr. I Made Wahyu Diyatmika from Germany’s VON ARDENNE. From industry, Bryce Liu, Sales Manager of TRUMPF Taiwan, also participated.
The speakers’ expertise spanned artificial intelligence, plasma science, computational simulation, thin-film processes, semiconductor equipment, and industrial applications, giving the conference a balance of fundamental research, technological development, and industry practice. Among them, Professor MunPyo Hong also serves as Director of FIP-FPM@KU, the Fraunhofer Innovation Platform at Korea University, which focuses on materials and process technologies for advanced displays, semiconductors, communications, and energy devices. His participation in ICAPS 2026 also facilitated exchange between Taiwan’s FIP-SPE@FCU and Korea’s FIP-FPM@KU, creating new opportunities for future cross-border research and industry collaboration among Fraunhofer Innovation Platforms in Asia.
In addition to oral presentations, this year’s conference featured 57 poster papers covering six major themes: plasma science and diagnostics, emerging plasma technologies for semiconductors, advanced packaging and heterogeneous integration, plasma process digitalization and artificial intelligence, semiconductor sustainability, and green manufacturing. The poster sessions presented diverse outcomes ranging from fundamental plasma research and process development to smart equipment and industrial applications, providing young researchers with a valuable platform for in-depth exchange with domestic and international experts. The exhibition area also featured six major domestic and international companies from the semiconductor supply chain, which presented advanced products on site.
ICAPS 2026 featured 57 poster papers, allowing young researchers to exchange their research findings with experts on site.
ICAPS 2026 extended special thanks to corporate partners including C SUN and the G2C+ Alliance, as well as several other sponsors, and to the Lo Ming-Ho Academic Development Fund for its support. By connecting research and industry networks across Taiwan, Germany, Korea, Japan, and Hong Kong, the conference promoted interdisciplinary dialogue among artificial intelligence, plasma technology, and semiconductor manufacturing. It also demonstrated FIP-SPE@FCU’s ability to integrate resources from international research institutions, universities, and enterprises.
The conference further deepened Taiwan’s collaboration with international partners in applied research, technology validation, talent development, and industrial innovation, expanding stronger global connections for Taiwan’s advanced manufacturing and semiconductor technologies.
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