TSMC 2025 Pre-Registration Recruitment Event - Feng Chia University Exclusive

Feng Chia University has always been an important partner in the semiconductor field, enjoying an excellent reputation in technical research and innovation. Since 2020, Feng Chia University and TSMC have co-hosted multiple corporate briefings and resume clinics. On September 25, 2024, the TSMC mobile recruitment vehicle returned to Feng Chia campus to officially launch the "Pre-Registration Program" for 2025 graduates, holding a physical event in front of the Administration Building 1 and Jong Chin Building Plaza to pre-hire like-minded partners to join TSMC.

This TSMC recruitment event, exclusive to Feng Chia University, attracted over 750 master's, doctoral, and undergraduate students to participate enthusiastically. Although some students could not immediately apply for employment, they could first take the "Semiconductor Program" jointly organized by Feng Chia University and TSMC, select courses independently, and receive a TSMC program certificate upon completing the program requirements. For Feng Chia students aspiring to the semiconductor industry, acquiring relevant training outside their professional fields not only deepens their understanding of industry development but also keeps them abreast of corporate needs and accumulates their own qualifications.

The 2025 "TSMC Pre-Registration Program" broadly invites graduates in fields such as electronics, electrical engineering, optoelectronics, communications, mechatronics, physics, materials, chemical engineering, computer science, industrial engineering, environmental engineering, statistics, and management to submit their resumes early, allowing them to receive job offers before graduation and start working immediately. Feng Chia University is a comprehensive university with a complete range of departments, and the values and characteristics of its students align with TSMC's recruitment direction. The recruitment event combines emerging technologies favored by young people today, inviting students who submit resumes to the site to directly interact with Feng Chia alumni, inspiring students' motivation and understanding of the workplace, and helping them prepare early for their future career paths.

In addition to pre-scheduled appointments with alumni, the event also allowed students to submit resumes on-site and interact with HR personnel present, asking questions up close and receiving detailed guidance. From the event, the active participation of students was evident, and changes in students were observed every year, especially in their proactivity, professionalism, and confidence. Feng Chia University and TSMC will continue to cooperate, not only jointly cultivating future talents but also having more opportunities for close industry-academia collaboration.

The TSMC mobile recruitment vehicle entered Feng Chia campus on September 25 to conduct recruitment activities.

The TSMC recruitment event, exclusive to Feng Chia University, attracted over 750 master's, doctoral, and undergraduate students to participate.

The mobile recruitment vehicle combined emerging technologies favored by young people today to further introduce students to TSMC.