FIP-SPE@FCU Hosts ICAPS 2026, Bringing Together Scholars from Taiwan, Germany, Korea, Japan, and Hong Kong to Discuss Smart Semiconductor Plasma Processes
The 2026 International Conference on Advanced Plasma for Semiconductors (ICAPS 2026), organized by the Feng Chia University–Fraunhofer Innovation Platform (FIP-SPE@FCU), was held from July 8 to 9 at Xue Si Building on the Feng Chia University campus. Under the theme of “Simulation, Artificial Intelligence, and Plasma Processes in Semiconductor Manufacturing,” the conference attracted approximately 160 scholars, research institute representatives, industry experts, and young researchers from Taiwan, Germany, Korea, Japan, and Hong Kong to explore the latest research achievements and technological developments in advanced semiconductor manufacturing.
