FIP-SPE@FCU Hosts Workshop on High-Density Plasma for Advanced Semiconductor Packaging

To strengthen Taiwan–Germany scientific collaboration and advance the development of next-generation semiconductor packaging technologies, the FIP-SPE@FCU hosted the Workshop on “High-Density Plasma for Advanced Semiconductor Packaging” on October 30, 2025, at Feng Chia University. The workshop brought together leading experts and scholars from academia, research institutes, and industry to explore the latest developments and future trends in high-density plasma technology for semiconductor manufacturing.

The event was chaired by Prof. Ju-Liang He, Director of FIP-SPE@FCU, and opened with welcome remarks from Prof. Kuo-Hao Tang, Vice President of Feng Chia University, and Mr. Julian Goldmann, Head of Science & Technology at the German Institute Taipei. Following the opening session, Dr.-Ing. Ralf Bandorf, Deputy Director of FIP-SPE@FCU and Group Manager of Optical and Electrical Systems at Fraunhofer IST, delivered the keynote presentation titled “High Density Plasma — Generation and Principles,” providing in-depth insights into the mechanisms and potential applications of high-density plasma.

The workshop was opened by Prof. Ju-Liang He, with welcome remarks from Mr. Julian Goldmann, Head of Science & Technology at the German Institute Taipei, and Prof. Kuo-Hao Tang, Vice President of Feng Chia University.

The subsequent technical sessions covered a diverse range of plasma-related topics. Mr. Bryce Liu, Manager at TRUMPF Taiwan Industries, presented the latest advances in Laser-Induced Deep Etching, while Prof. Ying-Hung Chen from Feng Chia University introduced VHF-CCP for ABF Plasma Etching.Dr. Chien-lie Li, COO of Vesta Microsystems, discussed 3DIC Megatrend and its crucial role in chip integration, and Mr. Adam Shern, President of ASHERN Technology, shared key considerations on Power Supplies for Plasma Etching Stability.

After the break, Dr.-Ing. Christian Stein from Fraunhofer IST presented Diamond Coating Technology for Highly Resistant Surfaces and Heat Spreading. Mr. David Chen, President of Libra, introduced recent findings on HIPIMS for TGV Interposer Applications. Prof. Ping Yen Hsieh from Feng Chia University discussed research progress on Gas Flow Sputter Coatings for Anti-Plasma Etching, and Prof. Ju-Liang He concluded the technical program with a presentation on Diamond-Like Carbon for Electrostatic Dissipation. The workshop closed with a summary report by Dr.-Ing. Ralf Bandorf, who reviewed the key highlights of the day and expressed appreciation to all speakers and participants for their valuable contributions.

The workshop showcased FIP-SPE@FCU’s strong research capabilities in high-density plasma and semiconductor packaging technologies, further reinforcing the collaborative foundation between Taiwan and Germany. Through interdisciplinary exchanges, the event contributed to advancing innovation in smart manufacturing and next-generation materials engineering.

Workshop on High-Density Plasma for Advanced Semiconductor Packaging.