Fraunhofer IST Delegation Visits Feng Chia University to Advance FIP-SPE@FCU Collaboration

News 2025.11.06

Fraunhofer IST Delegation Visits Feng Chia University to Advance FIP-SPE@FCU Collaboration.

FIP-SPE@FCU Hosts Workshop on High-Density Plasma for Advanced Semiconductor Packaging

News 2025.11.05

FIP-SPE@FCU Hosts Workshop on High-Density Plasma for Advanced Semiconductor Packaging.

DE-TW Joint Project Launched under MOEA Program to Develop Smart Coating Technology at FIP-SPE@FCU

News 2025.11.04

DE-TW Joint Project Launched under MOEA Program to Develop Smart Coating Technology at FIP-SPE@FCU.

15th International Conference on Fundamentals and Industrial Applications of HIPIMS 2025

Events 2025.03.06

HiPIMS Today 2025

Events 2025.03.06

Taiwan's First! Feng Chia University Partners with Fraunhofer Society to Establish Innovation Platform

News 2025.03.06